Surface Mount Ultrafast Rectifiers

FEATURES • Very low profile - typical height of 0.65 mm • Ideal for automated placement • Oxide planar chip junction • Low forward voltage drop, low power losses • Ultrafast recovery times for high frequency • Meets MSL level 1, per J-STD-020C, LF maximum peak of 260 °C • AEC-Q101 qualifie

High Current Density Surface Mount Ultrafast Rectifiers

FEATURES • Very low profile - typical height of 1.0 mm • Ideal for automated placement • Glass passivated pellet chip junction • Ultrafast recovery times for high efficiency • Low forward voltage, low power losses • Low thermal resistance • Meets MSL level 1 per J-STD-020, LF maximum peak

High Current Density Surface-Mount Ultrafast Rectifiers

FEATURES • Very low profile - typical height of 1.0 mm • Ideal for automated placement • Glass passivated pellet chip junction • Ultrafast recovery times for high frequency • Low forward voltage drop, low power loss • Low thermal resistance • Meets MSL level 1 per J-STD-020, LF maximum peak

Surface-Mount ESD Capability Rectifier

FEATURES • Very low profile - typical height of 0.65 mm • Ideal for automated placement • Oxide planar chip junction • Low forward voltage drop, low leakage current • ESD capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q101 qualified available - Automotive

Surface-Mount ESD Capability Rectifier

FEATURES • Very low profile - typical height of 0.65 mm • Ideal for automated placement • Oxide planar chip junction • Low forward voltage drop, low leakage current • ESD capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q101 qualified available - Automotive