ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

FEATURES Cu wire interconnect for low cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options ExposedPad configuration for increased thermal efficiency Up to 60% improvement in Theta JA (compared to standard TSSOP or

TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages

FEATURES Cu wire interconnect for lowest cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options Available in ExposedPad configuration (Ref: DS571) Green materials are standard – Pb-free and RoHS compliant Stealth dicin

High Efficiency White LED Driver

General Description The MP1521 is a constant-current Boost Regulator. This IC has three individual current-sensing feedbacks, which are ideal for driving multiple strings of series connected LEDs. The OLS pin is designed for detecting loose or open LED connections. The IC uses a peak current

SUGGESTED PAD LAYOUT

文件：188.29 Kbytes Page：14 Pages

Package Outline

文件：180.5 Kbytes Page：1 Pages

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

Reference Pattern Layout Dimensions

文件：342.14 Kbytes Page：4 Pages

A1 : MIN 0.000 MAX 0.150 A2 : MIN 0.750 MAX 0.952

文件：61.08 Kbytes Page：1 Pages

Carrier Width (W) 12.0-0.1 mm Pitch (P) 4.0-0.1 mm

文件：36.17 Kbytes Page：1 Pages

SUGGESTED PAD LAYOUT

Package Outline

文件：188.34 Kbytes Page：1 Pages

A1 : MIN 0.000 MAX 0.150 A2 : MIN 0.750 MAX 0.952

文件：61.08 Kbytes Page：1 Pages

Carrier Width (W) 12.0-0.1 mm Pitch (P) 4.0-0.1 mm

文件：36.17 Kbytes Page：1 Pages

LSI Assembly

文件：38.95 Kbytes Page：2 Pages

Thermal Resistance and Derating Information

文件：95.99 Kbytes Page：1 Pages

LSI Assembly

SUGGESTED PAD LAYOUT

文件：188.29 Kbytes Page：14 Pages

1.1W AUDIO POWER AMPLIFIER WITH SHUTDOWN MODE

文件：231.81 Kbytes Page：6 Pages

A1 : MIN 0 MAX 0.20 A2 : MIN 0.75 MAX 0.95

文件：90.43 Kbytes Page：1 Pages

MicroSIZE, Single-Supply CMOS OPERATIONAL AMPLIFIERS MicroAmplifier
Series

文件：1.19272 Mbytes Page：25 Pages

Carrier Width (W) 12.0-0.1 mm Pitch (P) 4.0-0.1 mm

文件：27.55 Kbytes Page：1 Pages

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

Carrier Width (W) 12.0-0.1 mm Pitch (P) 4.0-0.1 mm

文件：35.19 Kbytes Page：1 Pages

A1 : MIN 0.000 MAX 0.150 A2 : MIN 0.750 MAX 0.950

文件：58.36 Kbytes Page：1 Pages

Package Outline

文件：118.48 Kbytes Page：1 Pages

Packaging Information / Reference Pattern Layout Dimensions

文件：198.26 Kbytes Page：3 Pages

Packaging Information / Reference Pattern Layout Dimensions

文件：217.25 Kbytes Page：3 Pages

Package Outline

文件：130.58 Kbytes Page：1 Pages

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

Wide Band RF Switch

SUGGESTED PAD LAYOUT

文件：188.29 Kbytes Page：14 Pages

Carrier Width (W) 12.0-0.1 mm Pitch (P) 4.0-0.1 mm

文件：27.55 Kbytes Page：1 Pages

A1 : MIN 0.000 MAX 0.150 A2 : MIN 0.750 MAX 0.950

文件：58.36 Kbytes Page：1 Pages

A1 : MIN 0.000 MAX 0.150 A2 : MIN 0.750 MAX 0.950

文件：58.36 Kbytes Page：1 Pages