RF & MICROWAVE TRANSISTORS 800 - 900 MHz APPLICATIONS

DESCRIPTION: The MS1455 is a 12.5 V Class C epitaxial silicon NPN planar transistor designed for amplifier applications in the 806-866 MHz frequency range. Internal impedance matching assures optimum gain and efficiency across the entire frequency band. Gold metalization and emitter ballast resis

RF & MICROWAVE TRANSISTORS 800 - 900 MHz APPLICATIONS

Extruded Aluminum Enclosures

Key Features: Designed to house P.C. boards or for equipment interfacing. Sized for standard Eurocards. P.C. boards mount horizontally by sliding into internal slots extruded into the enclosure body. Rugged body constructed from extruded aluminum with a minimum thickness of .06” (1.5 mm). E

Extruded Aluminum Enclosures

Key Features: Designed to house P.C. boards or for equipment interfacing. Sized for standard Eurocards. P.C. boards mount horizontally by sliding into internal slots extruded into the enclosure body. Rugged body constructed from extruded aluminum with a minimum thickness of .06” (1.5 mm). E

Extruded Aluminum Enclosures

Key Features: Designed to house P.C. boards or for equipment interfacing. Sized for standard Eurocards. P.C. boards mount horizontally by sliding into internal slots extruded into the enclosure body. Rugged body constructed from extruded aluminum with a minimum thickness of .06” (1.5 mm). E

Extruded Aluminum Enclosures

Key Features: Designed to house P.C. boards or for equipment interfacing. Sized for standard Eurocards. P.C. boards mount horizontally by sliding into internal slots extruded into the enclosure body. Rugged body constructed from extruded aluminum with a minimum thickness of .06” (1.5 mm). E

Extruded Aluminum Enclosures

Key Features: Designed to house P.C. boards or for equipment interfacing. Sized for standard Eurocards. P.C. boards mount horizontally by sliding into internal slots extruded into the enclosure body. Rugged body constructed from extruded aluminum with a minimum thickness of .06” (1.5 mm). E