6 MOSFET Multi-Chip Module

DESCRIPTION The MM196 is a Multi-Chip Module, MCM, incorporating 6 independent MOSFET die into a convenient BGA package. This device is also available as discrete individual packaged Powermite3, see Microsemi data sheet UPF1N100. This device is also available as bare die, see Microsemi data sheet

6 MOSFET Multi-Chip Module

PGA ZIF Test & Burn-in Socket for Any Footprint on Std 8x8 to 21x21 Grid

FEATURES • Strong Metal Cam Activates Normally-closed Contacts, Preventing Dependency on Plastic for Contact Force • Handle mounted on Right- or Left-hand Side • Any Footprint Accepted on Standard 13x13 to 21x21 Grid GENERAL SPECIFICATIONS • SOCKET BODY: black UL 94V-0 Polyphenylene Sulfid

Double Layer Capacitors

FEATURES • Polarized capacitor with high charge density,    alternative product to rechargeable backup    batteries • Dielectric: electric double layer • Radial leads, cylindrical case, insulated with a    blue sleeve • Available in both vertical and low-profile versions • Unlimited charge

MINIATURE FUSES - 5x20mm

文件：87.25 Kbytes Page：2 Pages

RUGGED and LIGHTWEIGHT ALUMINUM BATTERY HOLDERS

文件：115.71 Kbytes Page：2 Pages

Temperature Sensors Line Guide

文件：736.09 Kbytes Page：11 Pages