MIC 13??2? x 1-1/2? 250Vac pin indicating fast-acting supplemental fuses

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包装：散装 描述：BUSS MIDGET FUSE 电路保护 电气专用保险丝

熔断器/电流保护器

Packetarium XLe Ultra High Performance Blade Server with 100G Switched Midplane

Features ƒƒ Highest CPU and I/O density platform in the Packetarium XL family ƒƒ Up to 12 CPU blades with single Intel® Xeon® Processor E5-2600 v3/v4 ƒƒ Up to 2Tbps switching capacity with 100Gbps midplane connectivity per blade ƒƒ Flexible I/O configurations with up to 6 PHY Mezzanine Module

Packetarium XLe Ultra High Performance Blade Server with 100G Switched Midplane

Features ƒƒ Highest CPU and I/O density platform in the Packetarium XL family ƒƒ Up to 12 CPU blades with single Intel® Xeon® Processor E5-2600 v3/v4 ƒƒ Up to 2Tbps switching capacity with 100Gbps midplane connectivity per blade ƒƒ Flexible I/O configurations with up to 6 PHY Mezzanine Module

6U Carrier Grade Blade Server for Edge Computing and NFV

Features ƒƒ Carrier Grade Blade Server with support for industry standard software frameworks accelerates the roll-out of next-generation NFV solutions ƒƒ Up to 9 front slots for hot-swappable Intel® Xeon® Processor E5-2600 or Intel® Xeon® Processor D based CPU blades for cloud networking and

6U Carrier Grade Blade Server for Edge Computing and NFV

Features ƒƒ Carrier Grade Blade Server with support for industry standard software frameworks accelerates the roll-out of next-generation NFV solutions ƒƒ Up to 9 front slots for hot-swappable Intel® Xeon® Processor E5-2600 or Intel® Xeon® Processor D based CPU blades for cloud networking and

2U4N Rackmount Server, Designed for Hyper-converged and HPC Application

Features ƒƒ Up to 4 Hot-Swappable CPU Node boards with dual Intel® Xeon® Scalable Processors ƒƒ Up to 16 DIMM slots DDR4 2666MHz RDIMM/LRDIMM 3DS (per Node) ƒƒ Flexible I/O configurations with up to 2x PCIe Gen3 x16 slots (half length, low profile) (per Node) ƒƒ Support one PCIe Gen3 x8 OCP

2U4N Rackmount Server, Designed for Hyper-converged and HPC Application

Features ƒƒ Up to 4 Hot-Swappable CPU Node boards with dual Intel® Xeon® Scalable Processors ƒƒ Up to 16 DIMM slots DDR4 2666MHz RDIMM/LRDIMM 3DS (per Node) ƒƒ Flexible I/O configurations with up to 2x PCIe Gen3 x16 slots (half length, low profile) (per Node) ƒƒ Support one PCIe Gen3 x8 OCP

Micro EM Clutch

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