封装/外壳：32-SSOP（0.295"，7.50mm 宽）裸露焊盘 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC INTERFACE SPECIALIZED 32SOIC 集成电路（IC） 专用

System Basis Chip, 2x 3.3 V/400mA LDOs, 3 wakeup, SOIC 32

SBC Gen2 with CAN High Speed and LIN Interface

SBC Gen2 with CAN High Speed and LIN Interface The 33903/4/5 is the second generation family of the System Basis Chip (SBC). It combines several features and enhances present module designs. The device works as an advanced power management unit for the MCU with additional integrated circuits

SBC Gen2 with CAN high speed and LIN interface

SBC Gen2 with CAN High Speed and LIN Interface

SBC Gen2 with CAN High Speed and LIN Interface The 33903/4/5 is the second generation family of the System Basis Chip (SBC). It combines several features and enhances present module designs. The device works as an advanced power management unit for the MCU with additional integrated circuits

SBC Gen2 with CAN High Speed and LIN Interface

SBC Gen2 with CAN High Speed and LIN Interface The 33903/4/5 is the second generation family of the System Basis Chip (SBC). It combines several features and enhances present module designs. The device works as an advanced power management unit for the MCU with additional integrated circuits

SBC Gen2 with CAN high speed and LIN interface

SBC Gen2 with CAN High Speed and LIN Interface

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封装/外壳：32-SSOP（0.295"，7.50mm 宽）裸露焊盘 包装：托盘 描述：IC INTERFACE SPECIALIZED 32SOIC 集成电路（IC） 专用