INTEGRATED CIRCUITS

INTEGRATED CIRCUITS FROM MOTOROLA MDTL integrated circuits provide an excellent balance of speed power dissipation, and noise immunity for general purpose digital applications. The line includes many multifunction types. Additional logic power is provided by the wired OR capability of the basic M

SUBMINIATURE PC BOARD RELAY

FEATURES • Subminiature size for high density packaging • DIL pitch terminals • Epoxy sealed for automatic wave soldering • High sensitivity: 150 mW nominal with 84 mW pickup • Meets FCC Part 68.302 1500 V lightning surge • Meets FCC Part 68.304 1000 V dielectric • UL / CUR file E43203

SUBMINIATURE PC BOARD RELAY

FEATURES • Subminiature size for high density packaging • DIL pitch terminals • Epoxy sealed for automatic wave soldering • High sensitivity: 150 mW nominal with 84 mW pickup • Meets FCC Part 68.302 1500 V lightning surge • Meets FCC Part 68.304 1000 V dielectric • UL file E43203; CSA file

SUBMINIATURE PC BOARD RELAY

[Zettler] FEATURES • Subminiature size for high density packaging • DIL pitch terminals • Epoxy sealed for automatic wave soldering • High sensitivity: 150 mW nominal with 84 mW pickup • Meets FCC Part 68.302 1500 V lightning surge • Meets FCC Part 68.304 1000 V dielectric • UL file E43203

CONN PLUG USB3.0 MICRO USB B SLD

文件：152.96 Kbytes Page：1 Pages

CONN PLUG USB3.0 MICRO USB B SLD

文件：152.96 Kbytes Page：1 Pages