Coil Components (SMD)

■ Features 1.Excellent High Frequency Characteristics Insertion loss: 0.6 dB TYP. Phase balance: ±3deg TYP. 2.Highly Reliable Design PPS resin is used for the exterior cladding of the cover, glass epoxy substrate is used for the board material, and solder plating is used for

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

Mini 7/8 Female 4 Pin Field Attachable

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5횞20mm fast-acting glass body cartridge fuse designed to IEC specification

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Direct replacement for E27 (European Standard)

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1.5A Three Terminal Adj. Voltage Regulator

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