超低功耗、高动态性能、22Msps模拟前端

MAX5864超低功耗、高集成度模拟前端可理想用于便携式通信设备，如手机、PDA、WLAN以及3G无线终端。MAX5864集成双路8位接收ADC和双路10位发送DAC，能以极低的功耗提供较高的动态性能。ADC的模拟I-Q输入放大器为全差分结构，可接受1VP-P满量程信号。I-Q通道的典型相位匹配为±0.1°，幅度匹配为±0.03dB。在fIN = 5.5MHz和fCLK = 22Msps时，ADC的SINAD为48.5dB，无杂散动态范围(SFDR)为69dBc。DAC的模拟I-Q输出为全差分结构，满量程输出为±400mV，共模电压为1.4V。I-Q通道的典型相位匹配为±0.15°，增益匹配为 • 集成的双路8位ADC与双路10位DAC\n• 超低功耗\n• fCLK = 22MHz时42mW (收发器模式)\n• fCLK = 15.36MHz时34mW (收发器模式)\n• 低电流空闲与关断模式\n\n\n• 优异的动态性能\n• fIN = 5.5MHz时SINAD为48.5dB (ADC)\n• fOUT = 2.2MHz时SFDR为71.7dB (DAC)\n\n\n• 优异的增益/相位匹配\n• fIN = 5.5MHz时±0.1°相位匹配，±0.03dB增益匹配(ADC)\n\n\n• 内部/外部基准选择\n• +1.8V至+3.3V数字输出电平(TTL/CMOS兼容);

Ultra-Low-Power, High-Dynamic- Performance, 22Msps Analog Front End

文件：2.07977 Mbytes Page：26 Pages

Ultra-Low-Power, High-Dynamic- Performance, 22Msps Analog Front End

文件：2.07977 Mbytes Page：26 Pages

Ultra-Low-Power, High-Dynamic- Performance, 22Msps Analog Front End

文件：2.07977 Mbytes Page：26 Pages

Ultra-Low-Power, High-Dynamic- Performance, 22Msps Analog Front End

文件：2.07977 Mbytes Page：26 Pages

封装/外壳：48-WFQFN 裸露焊盘 包装：托盘 描述：IC AFE 4 CHAN 10BIT 48TQFN 集成电路（IC） 模拟前端（AFE）

封装/外壳：48-WFQFN 裸露焊盘 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC AFE 4 CHAN 10BIT 48TQFN 集成电路（IC） 模拟前端（AFE）

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Description: The NTE5864 through NTE5889 are silicon power rectifier diodes in a DO4 type package designed with very low leakage current as well as good surge handling capability. These devices are ideal for use in applications where economy, power capability, and reliability are demanding consid

Digital Audio D/A Converter

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