Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·Return Loss > 16 dB 13 to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Flat Response From DC to 40 GHz\n·Medium Power Handling 2W CW\n·DC to 40 GHz\n·Very Good Stability Over Temperature (TCR < 100 PPM)\n·Space Saving Footprint .030” X .030” (762 X .762mm)\n·Ground Wrap to Top (No ground bond;

Attenuator DIE

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封装/外壳：模具 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：ATTENUATOR,DIE,29DB RF/IF，射频/中频和 RFID 衰减器

Micastat Dissipative Laminate

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Nylon PCB Supports - Imperial Spacing

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HIGH POWER UV-VIS FIBER LIGHT SOURCE

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