Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·Very Good Stability Over Temperature (TCR16 dB 13 to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Flat Response From DC to 40 GHz\n·Medium Power Handling 2W CW\n·DC to 40 GHz\n·Ground Wrap to Top (No ground bonding required);

Attenuator DIE

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ULTRA FAST RECOVERY RECTIFIERS

Ultra Fast Recovery Rectifiers ● Ultra Fast Recovery Rectifiers ● 175°C Junction Temperature ● 100 Amps current rating ● VRRM 600 to 800 Volts ● tRR 120 nsec maximum

ULTRA FAST RECOVERY MODULES

Ultrafast Recovery Modules • Ultra Fast Recovery • 175°C Junction Temperature • VRRM 100 to 800 Volts • Electrically isolated base • 2 X 50 Amp current rating • ROHS Compliant

Ultrafast Recovery Modules

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Ultrafast Recovery Modules

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