Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·Return Loss > 18 dB DC to 12 GHz\n·Flat Response From DC to 40 GHz\n·Medium Power Handling 2W CW\n·DC to 40 GHz;

封装/外壳：模具 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：DIE, ATTENUATOR, 26DB RF/IF，射频/中频和 RFID 衰减器

Attenuator DIE

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ULTRA FAST RECOVERY RECTIFIERS

Ultra Fast Recovery Rectifiers ● Ultra Fast Recovery Rectifiers ● 175°C Junction Temperature ● 100 Amps current rating ● VRRM 600 to 800 Volts ● tRR 120 nsec maximum

ULTRA FAST RECOVERY MODULES

Ultrafast Recovery Modules • Ultra Fast Recovery • 175°C Junction Temperature • VRRM 100 to 800 Volts • Electrically isolated base • 2 X 50 Amp current rating • ROHS Compliant

Ultrafast Recovery Modules

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NON-METALLIC ENCLOSURE (STYLE B)

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Ultrafast Recovery Modules

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