Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·Return Loss > 16 dB 13 to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Flat Response From DC to 40 GHz\n·Medium Power Handling 2W CW\n·DC to 40 GHz\n·Ground Wrap to Top (No ground bonding required)\n·Very Good Stability Over Temperature (TCR < 100 PPM)\n·Space Saving Footprint .030” X .030” (;

Attenuator DIE

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LED Lighting Surge Protection Module > LSP10

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NON-METALLIC ENCLOSURE (STYLE B)

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Solid State Relay for printed circuit board

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Solid State Relay for printed circuit board

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T1/CEPT Pulse Transformer

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