Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·Ground Wrap to Top (No ground bonding required)\n·Very Good Stability Over Temperature (TCR16 dB 13 to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Flat Response From DC to 40 GHz\n·Medium Power Handling 2W CW\n·DC to 40 GHz;

封装/外壳：模具 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：RF ATTENUATOR 11DB DIE RF/IF，射频/中频和 RFID 衰减器

Attenuator DIE

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SILICON SURGE SUPPRESSOR DIODES

[LEDEX]

SILICON SURGE SUPPRESSOR DIODES

[LEDEX]

Dual 3-Input/3-Output OR Gate

Dual 3-Input/3-Output OR Gate The ability to control three parallel lines from a single point makes the MC10110 particularly useful in clock distribution applications where minimum clock skew is desired. Three VCC pins are provided and each one should be used. • PD = 80 mW typ/pkg (No Load) • t

Dual 3-Input/3-Output OR Gate

Dual 3-Input/3-Output OR Gate The ability to control three parallel lines from a single point makes the MC10110 particularly useful in clock distribution applications where minimum clock skew is desired. Three VCC pins are provided and each one should be used. • PD = 80 mW typ/pkg (No Load) • t

Dual 3-Input/3-Output OR Gate

Dual 3-Input/3-Output OR Gate The MC10110 is designed to drive up to three transmission lines simul– taneously. The multiple outputs of this device also allow the wire “OR”–ing of several levels of gating for minimization of gate and package count. The ability to control three parallel lines fro