型号 功能描述 生产厂家&企业 LOGO 操作
M470T6554CZ0

DDR2UnbufferedSODIMM

Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd

SamsungSamsung Group

三星三星半导体

Samsung

DDR2UnbufferedSODIMM

Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd

SamsungSamsung Group

三星三星半导体

Samsung

DDR2UnbufferedSODIMM200pinUnbufferedSODIMMbasedon512MbC-die64bitNon-ECC

Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd

SamsungSamsung Group

三星三星半导体

Samsung

DDR2UnbufferedSODIMM200pinUnbufferedSODIMMbasedon512MbC-die64bitNon-ECC

Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd

SamsungSamsung Group

三星三星半导体

Samsung

DDR2UnbufferedSODIMM

Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd

SamsungSamsung Group

三星三星半导体

Samsung

DDR2UnbufferedSODIMM200pinUnbufferedSODIMMbasedon512MbC-die64bitNon-ECC

Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd

SamsungSamsung Group

三星三星半导体

Samsung

DDR2UnbufferedSODIMM200pinUnbufferedSODIMMbasedon512MbC-die64bitNon-ECC

Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd

SamsungSamsung Group

三星三星半导体

Samsung

DDR2UnbufferedSODIMM200pinUnbufferedSODIMMbasedon512MbC-die64bitNon-ECC

Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd

SamsungSamsung Group

三星三星半导体

Samsung

DDR2UnbufferedSODIMM200pinUnbufferedSODIMMbasedon512MbC-die64bitNon-ECC

Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd

SamsungSamsung Group

三星三星半导体

Samsung

DDR2UnbufferedSODIMM200pinUnbufferedSODIMMbasedon512MbC-die64bitNon-ECC

Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd

SamsungSamsung Group

三星三星半导体

Samsung

DDR2UnbufferedSODIMM200pinUnbufferedSODIMMbasedon512MbC-die64bitNon-ECC

Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd

SamsungSamsung Group

三星三星半导体

Samsung

DDR2UnbufferedSODIMM

Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd

SamsungSamsung Group

三星三星半导体

Samsung

DDR2UnbufferedSODIMM

Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd

SamsungSamsung Group

三星三星半导体

Samsung

M470T6554CZ0产品属性

  • 类型

    描述

  • 型号

    M470T6554CZ0

  • 制造商

    SAMSUNG

  • 制造商全称

    Samsung semiconductor

  • 功能描述

    DDR2 Unbuffered SODIMM

更新时间:2024-5-10 17:57:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
SMART
三年内
1983
纳立只做原装正品13590203865
MICRON
1844+
BGA
6528
只做原装正品假一赔十为客户做到零风险!!
Samsung
21+
标准封装
5000
进口原装,订货渠道!
SAM
23+
NA
126
专做原装正品,假一罚百!
SAMSUNG
22+
252
原装现货,假一罚十
SAMSUNG(三星)
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持
MREL/麦瑞
23+
NA/
6184
原装现货,当天可交货,原型号开票
SAMSUNG(三星半导体)
23+
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
SAMSUNG/三星
BGA
265209
假一罚十原包原标签常备现货!
SAMSUNG/三星
22+
23509
郑重承诺只做原装进口货

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