位置：首页 > IC中文资料第6476页 > M29DW640D
| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
M29DW640D | 64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 |   | |
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | |
M29DW640D产品属性
- 类型
描述
- 型号
M29DW640D
- 制造商
STMICROELECTRONICS
- 制造商全称
STMicroelectronics
- 功能描述
64 Mbit(8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
ST |
2025+ |
TSOP48 |
3768 |
全新原厂原装产品、公司现货销售 |
|||
ST/意法 |
23+ |
BGA-63 |
13000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
|||
ST |
8 |
SOP |
488 |
原装正品 |
|||
ST/意法 |
2022+ |
TSOP48 |
30000 |
进口原装现货供应,原装 假一罚十 |
|||
ST |
TSOP48 |
3000 |
一级代理 原装正品假一罚十价格优势长期供货 |
||||
ST |
2511 |
TSOP48 |
16900 |
电子元器件采购降本 30%!盈慧通原厂直采,砍掉中间差价 |
|||
ST |
25+23+ |
BGA |
34886 |
绝对原装正品全新进口深圳现货 |
|||
ST |
23+ |
TSOP48 |
20000 |
全新原装假一赔十 |
|||
ST/意法 |
25+ |
TSOP48 |
54658 |
百分百原装现货 实单必成 |
|||
ST |
23+ |
TSOP-48P |
3000 |
原装正品假一罚百!可开增票! |
M29DW640D规格书下载地址
M29DW640D参数引脚图相关
- MP4
- MP3
- mos晶体管
- mos管
- MOSFET
- molex连接器
- mega16
- MCU
- mc34063
- mb881
- mb402
- max7219
- max706s
- max485esa
- max485csa
- max3232cse
- max232cse
- max232
- m628
- m358
- M2B_15
- M2AS1
- M2AMS2
- M2AMS
- M2ADS
- M2AC_15
- M29W400
- M29W160
- M29W102
- M29W040
- M29W022
- M29W004
- M29F512
- M29F400
- M29F200
- M29F160
- M29F100
- M29F040
- M29F010
- M29F002
- M29DW640D90N1T
- M29DW640D90N1F
- M29DW640D90N1E
- M29DW640D90N1
- M29DW640D70ZA6T
- M29DW640D70ZA6F
- M29DW640D70ZA6E
- M29DW640D70ZA6
- M29DW640D70ZA1T
- M29DW640D70ZA1F
- M29DW640D70ZA1E
- M29DW640D70ZA1
- M29DW640D70N6T
- M29DW640D70N6F
- M29DW640D70N6E
- M29DW640D70N6
- M29DW640D70N1T
- M29DW640D70N1F
- M29DW640D70N1E
- M29DW640D70N1
- M29DW324DT90ZE6T
- M29DW324DT90ZE6F
- M29DW324DT90ZE6E
- M29DW324DT90ZE6
- M29DW324DT90ZE1T
- M29DW324DT90ZE1F
- M29DW324DT90ZE1E
- M29DW324DT90ZE1
- M29DW324DT90ZA6T
- M29DW324DT90ZA6F
- M29DW324DT90ZA6E
- M29DW324DT90ZA6
- M29DW324DT90ZA1T
- M29DW324DT90ZA1F
- M29DW324DT90ZA1E
- M29DW324DT90ZA1
- M29DW324DT90N6T
- M29DW324DT90N6F
- M29DW324DT90N6E
- M29DW324DT90N6
- M2954
- M2951
- M2950
- M293B1
- M293010
- M29150B
- M29150A
- M2904
- M28W800
- M28W640
- M28ST-D
- M28ST-C
- M28ST-B
- M28ST
- M28S-D
- M28S-C
- M28S-B
- M28S_15
- M28S_13
- M28S_11
M29DW640D数据表相关新闻
M28W160ECB70ZB6 ST/Micron
www.hfxcom.com.
2021-11-11M28C64-A256，M28C64C-15M6，M28C64C-20M1，M28C64X-15M1，M28F101-100K1，M28LV16-25M6，M28LV17-25M6，M28LV64C-20M6，M29F102B-70K1，M34116B1，M74HC00，M74ACT74，M74ACT257，M74HC163，M74HC04，M74HC123
M28C64-A256，M28C64C-15M6，M28C64C-20M1，M28C64X-15M1，M28F101-100K1，M28LV16-25M6，M28LV17-25M6，M28LV64C-20M6，M29F102B-70K1，M34116B1，M74HC00，M74ACT74，M74ACT257，M74HC163，M74HC04，M74HC123
2019-12-29M29W128GL70ZS6E顺德利科技正品原装进口稳定的货源优势的价格
深圳市顺德利科技有限公司 0755-82725660 18128853661（微信75056055） QQ：782954141
2019-6-18M28W320FCT70N6E顺德利科技正品原装进口稳定的货源优势的价格
深圳市顺德利科技有限公司 0755-82725660 18128853661（微信75056055） QQ：782954141
2019-6-18M29W128GH70N6E顺德利科技正品原装进口稳定的货源优势的价格
深圳市顺德利科技有限公司 0755-82725660 18128853661（微信75056055） QQ：782954141
2019-6-18M29W128GL70N6E顺德利科技正品原装进口稳定的货源优势的价格
深圳市顺德利科技有限公司 0755-82725660 18128853661（微信75056055） QQ：782954141
2019-6-18
DdatasheetPDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86
- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
- P96
- P97
- P98
- P99
- P100
- P101
- P102
- P103
