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| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
M29DW640D | 64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 |   | |
M29DW640D | 64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory | STMICROELECTRONICS 意法半导体 | | |
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | |
M29DW640D产品属性
- 类型
描述
- 型号
M29DW640D
- 制造商
STMICROELECTRONICS
- 制造商全称
STMicroelectronics
- 功能描述
64 Mbit(8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
micron(镁光) |
25+ |
54-TSOP II |
6843 |
样件支持,可原厂排单订货! |
|||
micron(镁光) |
25+ |
54-TSOP II |
6895 |
正规渠道,免费送样。支持账期,BOM一站式配齐 |
|||
ST |
25+23+ |
BGA |
34886 |
绝对原装正品全新进口深圳现货 |
|||
ST/意法 |
22+ |
TSOP48 |
100000 |
代理渠道/只做原装/可含税 |
|||
ST/意法 |
2026+ |
TSOP48 |
54658 |
百分百原装现货 实单必成 |
|||
ST |
24+ |
TSSOP |
35200 |
一级代理/放心采购 |
|||
Micron Technology Inc. |
18500 |
全新原厂原装现货!受权代理!可送样可提供技术支持! |
|||||
ST/意法 |
25+ |
TSOP48 |
1000 |
全新原装正品支持含税 |
|||
ST |
24+ |
BGA |
31 |
||||
ST/意法 |
22+ |
NA |
20000 |
公司只有原装 品质保障 |
M29DW640D规格书下载地址
M29DW640D参数引脚图相关
- MP4
- MP3
- mos晶体管
- mos管
- MOSFET
- molex连接器
- mega16
- MCU
- mc34063
- mb881
- mb402
- max7219
- max706s
- max485esa
- max485csa
- max3232cse
- max232cse
- max232
- m628
- m358
- M2B_15
- M2AS1
- M2AMS2
- M2AMS
- M2ADS
- M2AC_15
- M29W400
- M29W160
- M29W102
- M29W040
- M29W022
- M29W004
- M29F512
- M29F400
- M29F200
- M29F160
- M29F100
- M29F040
- M29F010
- M29F002
- M29DW640D90N1T
- M29DW640D90N1F
- M29DW640D90N1E
- M29DW640D90N1
- M29DW640D70ZA6T
- M29DW640D70ZA6F
- M29DW640D70ZA6E
- M29DW640D70ZA6
- M29DW640D70ZA1T
- M29DW640D70ZA1F
- M29DW640D70ZA1E
- M29DW640D70ZA1
- M29DW640D70N6T
- M29DW640D70N6F
- M29DW640D70N6E
- M29DW640D70N6
- M29DW640D70N1T
- M29DW640D70N1F
- M29DW640D70N1E
- M29DW640D70N1
- M29DW324DT90ZE6T
- M29DW324DT90ZE6F
- M29DW324DT90ZE6E
- M29DW324DT90ZE6
- M29DW324DT90ZE1T
- M29DW324DT90ZE1F
- M29DW324DT90ZE1E
- M29DW324DT90ZE1
- M29DW324DT90ZA6T
- M29DW324DT90ZA6F
- M29DW324DT90ZA6E
- M29DW324DT90ZA6
- M29DW324DT90ZA1T
- M29DW324DT90ZA1F
- M29DW324DT90ZA1E
- M29DW324DT90ZA1
- M29DW324DT90N6T
- M29DW324DT90N6F
- M29DW324DT90N6E
- M29DW324DT90N6
- M2954
- M2951
- M2950
- M293B1
- M293010
- M29150B
- M29150A
- M2904
- M28W800
- M28W640
- M28ST-D
- M28ST-C
- M28ST-B
- M28ST
- M28S-D
- M28S-C
- M28S-B
- M28S_15
- M28S_13
- M28S_11
M29DW640D数据表相关新闻
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M28C64-A256，M28C64C-15M6，M28C64C-20M1，M28C64X-15M1，M28F101-100K1，M28LV16-25M6，M28LV17-25M6，M28LV64C-20M6，M29F102B-70K1，M34116B1，M74HC00，M74ACT74，M74ACT257，M74HC163，M74HC04，M74HC123
2019-12-29M29W128GL70ZS6E顺德利科技正品原装进口稳定的货源优势的价格
深圳市顺德利科技有限公司 0755-82725660 18128853661（微信75056055） QQ：782954141
2019-6-18M28W320FCT70N6E顺德利科技正品原装进口稳定的货源优势的价格
深圳市顺德利科技有限公司 0755-82725660 18128853661（微信75056055） QQ：782954141
2019-6-18M29W128GH70N6E顺德利科技正品原装进口稳定的货源优势的价格
深圳市顺德利科技有限公司 0755-82725660 18128853661（微信75056055） QQ：782954141
2019-6-18M29W128GL70N6E顺德利科技正品原装进口稳定的货源优势的价格
深圳市顺德利科技有限公司 0755-82725660 18128853661（微信75056055） QQ：782954141
2019-6-18
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