型号 功能描述 生产厂家&企业 LOGO 操作
M29DW640D

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

64Mbit(8Mbx8or4Mbx16,MultipleBank,Page,BootBlock)3VSupplyFlashMemory

FamilyOverview Densitiesfrom32Mbto64Mb 0.15µmprocesstechnology Wideapplicationareacovered technologyshrinkongoing higherdensities improvedperformances Increasedreliability MainFeatures M29DW323 32Mb(4Mbx8/2Mbx16),BootBlock AccessTi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

FLASHNORHIGHDENSITY&CONSUMER

FamilyOverview ➤Densitiesfrom32Mbto64Mb ➤0.15µmprocesstechnology ➤Wideapplicationareacovered ➤technologyshrinkongoing ➤higherdensities ➤improvedperformances ➤Increasedreliability MainFeatures ➤32Mb(4Mbx8/2Mbx16),BootBlock ➤AccessTime

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

M29DW640D产品属性

  • 类型

    描述

  • 型号

    M29DW640D

  • 制造商

    STMICROELECTRONICS

  • 制造商全称

    STMicroelectronics

  • 功能描述

    64 Mbit(8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory

更新时间:2024-6-17 12:41:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
ST
23+
SOP
8650
受权代理!全新原装现货特价热卖!
ST/意法
BGA-63
13000
原厂授权一级代理,专业海外优势订货,价格优势、品种
ST
20+
TSOP48
2960
诚信交易大量库存现货
ST
2016+
TSOP48
6528
只做原厂原装现货!终端客户个别型号可以免费送样品!
ST
22+
BGA
2195
原装正品!公司现货热卖!
ST
22+23+
BGA
34886
绝对原装正品全新进口深圳现货
ADI/亚德诺
23+
SOP16
69820
终端可以免费供样,支持BOM配单!
ST
22+
TSOP48
2960
诚信交易大量库存现货
ST
BGA-63
93480
集团化配单-有更多数量-免费送样-原包装正品现货-正规
ST
1904+
TSOP48
3000
自家现货!原装特价供货!一片起卖!

M29DW640D芯片相关品牌

  • ALLIED
  • DIODES
  • EATON
  • etc2
  • HARTING
  • Littelfuse
  • MERITEK
  • MOLEX1
  • NSC
  • RALTRON
  • SUMIDA
  • TEC

M29DW640D数据表相关新闻