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| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
M29DW640D | 64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 |   | |
M29DW640D | 64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory | STMICROELECTRONICS 意法半导体 | | |
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory Family Overview Densities from 32Mb to 64Mb 0.15µm process technology Wide application area covered technology shrink on going higher densities improved performances Increased reliability Main Features M29DW323 32Mb (4Mbx8 / 2Mbx16), Boot Block Access Ti | STMICROELECTRONICS 意法半导体 | | ||
FLASH NOR HIGH DENSITY & CONSUMER Family Overview ➤ Densities from 32Mb to 64Mb ➤ 0.15µm process technology ➤ Wide application area covered ➤ technology shrink on going ➤ higher densities ➤ improved performances ➤ Increased reliability Main Features ➤ 32Mb (4Mbx8 / 2Mbx16), Boot Block ➤ Access Time | STMICROELECTRONICS 意法半导体 | |
M29DW640D产品属性
- 类型
描述
- 型号
M29DW640D
- 制造商
STMICROELECTRONICS
- 制造商全称
STMicroelectronics
- 功能描述
64 Mbit(8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
MORIMATSU |
13+ |
TB |
210 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
UTC |
2450+ |
MSOP-8T/R |
9850 |
只做原装正品现货或订货假一赔十! |
|||
ST |
25+ |
BGA |
2140 |
全新原装!现货特价供应 |
|||
ST |
25+23+ |
BGA |
34886 |
绝对原装正品全新进口深圳现货 |
|||
ST |
23+ |
SOP |
8650 |
受权代理!全新原装现货特价热卖! |
|||
ST |
23+ |
PLCC |
16900 |
正规渠道,只有原装! |
|||
MORIMATSU |
13+ |
TB |
211 |
全新 发货1-2天 |
|||
ON/安森美 |
24+ |
SOP14 |
43200 |
郑重承诺只做原装进口现货 |
|||
UTC |
24+ |
SOP-8 |
5000 |
全新原装正品,现货销售 |
|||
UTC |
23+ |
SOP-8 |
20000 |
M29DW640D规格书下载地址
M29DW640D参数引脚图相关
- MP4
- MP3
- mos晶体管
- mos管
- MOSFET
- molex连接器
- mega16
- MCU
- mc34063
- mb881
- mb402
- max7219
- max706s
- max485esa
- max485csa
- max3232cse
- max232cse
- max232
- m628
- m358
- M2B_15
- M2AS1
- M2AMS2
- M2AMS
- M2ADS
- M2AC_15
- M29W400
- M29W160
- M29W102
- M29W040
- M29W022
- M29W004
- M29F512
- M29F400
- M29F200
- M29F160
- M29F100
- M29F040
- M29F010
- M29F002
- M29DW640D90N1T
- M29DW640D90N1F
- M29DW640D90N1E
- M29DW640D90N1
- M29DW640D70ZA6T
- M29DW640D70ZA6F
- M29DW640D70ZA6E
- M29DW640D70ZA6
- M29DW640D70ZA1T
- M29DW640D70ZA1F
- M29DW640D70ZA1E
- M29DW640D70ZA1
- M29DW640D70N6T
- M29DW640D70N6F
- M29DW640D70N6E
- M29DW640D70N6
- M29DW640D70N1T
- M29DW640D70N1F
- M29DW640D70N1E
- M29DW640D70N1
- M29DW324DT90ZE6T
- M29DW324DT90ZE6F
- M29DW324DT90ZE6E
- M29DW324DT90ZE6
- M29DW324DT90ZE1T
- M29DW324DT90ZE1F
- M29DW324DT90ZE1E
- M29DW324DT90ZE1
- M29DW324DT90ZA6T
- M29DW324DT90ZA6F
- M29DW324DT90ZA6E
- M29DW324DT90ZA6
- M29DW324DT90ZA1T
- M29DW324DT90ZA1F
- M29DW324DT90ZA1E
- M29DW324DT90ZA1
- M29DW324DT90N6T
- M29DW324DT90N6F
- M29DW324DT90N6E
- M29DW324DT90N6
- M2954
- M2951
- M2950
- M293B1
- M293010
- M29150B
- M29150A
- M2904
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- M28W640
- M28ST-D
- M28ST-C
- M28ST-B
- M28ST
- M28S-D
- M28S-C
- M28S-B
- M28S_15
- M28S_13
- M28S_11
M29DW640D数据表相关新闻
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M28C64-A256，M28C64C-15M6，M28C64C-20M1，M28C64X-15M1，M28F101-100K1，M28LV16-25M6，M28LV17-25M6，M28LV64C-20M6，M29F102B-70K1，M34116B1，M74HC00，M74ACT74，M74ACT257，M74HC163，M74HC04，M74HC123
2019-12-29M29W128GL70ZS6E顺德利科技正品原装进口稳定的货源优势的价格
深圳市顺德利科技有限公司 0755-82725660 18128853661（微信75056055） QQ：782954141
2019-6-18M28W320FCT70N6E顺德利科技正品原装进口稳定的货源优势的价格
深圳市顺德利科技有限公司 0755-82725660 18128853661（微信75056055） QQ：782954141
2019-6-18M29W128GH70N6E顺德利科技正品原装进口稳定的货源优势的价格
深圳市顺德利科技有限公司 0755-82725660 18128853661（微信75056055） QQ：782954141
2019-6-18M29W128GL70N6E顺德利科技正品原装进口稳定的货源优势的价格
深圳市顺德利科技有限公司 0755-82725660 18128853661（微信75056055） QQ：782954141
2019-6-18
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