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M275价格
参考价格：￥26.8069
型号：M27500-12SP4U00 品牌：TE Connectivity / Rayche 备注：这里有M275多少钱，2025年最近7天走势，今日出价，今日竞价，M275批发/采购报价，M275行情走势销售排行榜，M275报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
M275 | Totalizers mechanic 文件：362.25 Kbytes Page：2 Pages | IVO 堡盟电子 |   | |
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
Totalizers mechanic 文件：362.25 Kbytes Page：2 Pages | IVO 堡盟电子 | | ||
Totalizers mechanic 文件：362.25 Kbytes Page：2 Pages | IVO 堡盟电子 | | ||
控制电缆 | ETC 知名厂家 | ETC | | |
5x7 mm, 3.3 Volt, HCMOS/TTL Compatible Output, Clock Oscillator 文件：456.45 Kbytes Page：2 Pages | MTRONPTI | | ||
5x7 mm, 3.3 Volt, HCMOS/TTL Compatible Output, Clock Oscillator 文件：283.82 Kbytes Page：2 Pages | MTRONPTI | | ||
5x7 mm, 3.3 Volt, HCMOS/TTL Compatible Output, Clock Oscillator 文件：283.82 Kbytes Page：2 Pages | MTRONPTI | |
M275产品属性
- 类型
描述
- 型号
M275
- 制造商
IVO
- 制造商全称
Baumer IVO GmbH & Co. KG
- 功能描述
Totalizers mechanic
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
ST |
24+ |
DIP |
26200 |
原装现货,诚信经营! |
|||
MREL/麦瑞 |
24+ |
NA/ |
4000 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
|||
ADI |
23+ |
SOP |
12000 |
全新原装假一赔十 |
|||
ST |
25+ |
标准封装 |
18000 |
原厂直接发货进口原装 |
|||
ST |
20+ |
DIP |
67500 |
原装优势主营型号-可开原型号增税票 |
|||
ST |
24+/25+ |
564 |
原装正品现货库存价优 |
||||
INTERSIL |
24+ |
SMD |
500 |
“芯达集团”专营军工百分之百原装进口 |
|||
ST |
25+ |
FDIP |
4500 |
全新原装、诚信经营、公司现货销售! |
|||
ST |
CDIP-28 |
68500 |
一级代理 原装正品假一罚十价格优势长期供货 |
||||
ST/意法 |
2223+ |
CDIP-28 |
26800 |
只做原装正品假一赔十为客户做到零风险 |
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M275规格书下载地址
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