M275价格
参考价格：￥26.8069
型号：M27500-12SP4U00 品牌：TE Connectivity / Rayche 备注：这里有M275多少钱，2026年最近7天走势，今日出价，今日竞价，M275批发/采购报价，M275行情走势销售排行榜，M275报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
M275 | Totalizers mechanic 文件：362.25 Kbytes Page：2 Pages | IVO 堡盟电子 |   | |
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
General Purpose Airframe and Avionics Multi-Conductor Cables • Insulation/Jacket: Extruded cross-linked ETFE • Construction: Dual wall construction; primary wires with shield and outer jacket • Conductor: Stranded tinned copper • Shielding: Round tinned copper braid | TEC 泰科电子 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
NMOS 512K 64K x 8 UV EPROM DESCRIPTION The M27512 is a 524,288 bit UV erasable and electrically programmable memory EPROM. It is organized as 65,536 words by 8 bits. The M27512 is housed in a 28 Pin Window Ceramic Frit-Seal Dual-in-Line package. The transparent lid allows the user to expose the chip to ultraviolet light | STMICROELECTRONICS 意法半导体 | | ||
Totalizers mechanic 文件：362.25 Kbytes Page：2 Pages | IVO 堡盟电子 | | ||
Totalizers mechanic 文件：362.25 Kbytes Page：2 Pages | IVO 堡盟电子 | | ||
控制电缆 | TECHSPRAY | | ||
5x7 mm, 3.3 Volt, HCMOS/TTL Compatible Output, Clock Oscillator 文件：283.82 Kbytes Page：2 Pages | MTRONPTI | | ||
5x7 mm, 3.3 Volt, HCMOS/TTL Compatible Output, Clock Oscillator 文件：456.45 Kbytes Page：2 Pages | MTRONPTI | | ||
5x7 mm, 3.3 Volt, HCMOS/TTL Compatible Output, Clock Oscillator 文件：456.45 Kbytes Page：2 Pages | MTRONPTI | |
M275产品属性
- 类型
描述
- 最高工作温度：
+150°C
- 绝缘材料：
ETFE
- 导体材料：
镀锡铜
- 符合标准：
NEMA-WC-27500
- 护套材料：
ETFE
- 外径：
2.05mm
- 美国线规：
22 AWG
- 护套颜色：
白色
- 控制电缆类型：
铁路
- 长度：
100m
- 芯数：
1
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
ADI |
23+ |
SOP |
12000 |
全新原装假一赔十 |
|||
ST |
CDIP-28 |
68500 |
一级代理 原装正品假一罚十价格优势长期供货 |
||||
ST |
24+/25+ |
564 |
原装正品现货库存价优 |
||||
ST |
20+ |
DIP |
67500 |
原装优势主营型号-可开原型号增税票 |
|||
ST |
25+ |
CDIP |
20000 |
原装 |
|||
ST |
24+ |
DIP |
200 |
进口原装正品优势供应 |
|||
ST/意法 |
2223+ |
CDIP-28 |
26800 |
只做原装正品假一赔十为客户做到零风险 |
|||
ST |
25+ |
CDIP28 |
3629 |
原装优势!房间现货!欢迎来电! |
|||
OKI |
84 |
DIP-28 |
8 |
原装现货海量库存欢迎咨询 |
|||
ST/意法 |
2450+ |
CDIP |
8850 |
只做原装正品假一赔十为客户做到零风险!! |
M275规格书下载地址
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- M25PX64-VME6G
- M25PX32-VMW6E
- M25PX32-VMP6FBA
- M25PX16-VMW6TG
- M25PX16-VMW6G
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M28C64-A256，M28C64C-15M6，M28C64C-20M1，M28C64X-15M1，M28F101-100K1，M28LV16-25M6，M28LV17-25M6，M28LV64C-20M6，M29F102B-70K1，M34116B1，M74HC00，M74ACT74，M74ACT257，M74HC163，M74HC04，M74HC123
2019-12-29
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