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A18145-03中文资料

厂家型号

A18145-03

文件大小

183.12Kbytes

页面数量

2

功能描述

Thermal Gap Filler

数据手册

原厂下载下载地址一下载地址二到原厂下载

生产厂商

LSTD

A18145-03数据手册规格书PDF详情

PRODUCT DESCRIPTION

Tflex™ RB300 is an exceptionally soft gap filler pad with a thermal conductivity of

1.2 W/mK. Tflex RB300 is specially formulation to minimize the amount of silicone

oil bleed in sensitive applications.

Tflex™ RB300, in achieving its stellar compliancy, does not sacrifice thermal

performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances

can be achieved at low pressures.

Tflex™ RB300 is naturally tacky and requires no additional adhesive coating that

can inhibit thermal performance.

FEATURES AND BENEFITS

• Extreme compliancy allows material to “totally blanket” components

• Thermal conductivity of 1.2 W/mK

• Minimal silicone oil bleed

• Environmentally friendly solution that meets RoHS and REACH requirements

更新时间:2025-10-12 16:30:00
供应商 型号 品牌 批号 封装 库存 备注 价格
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MSOP8
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现货库存
N/A
2450+
MSOP8
9850
只做原厂原装正品现货或订货假一赔十!
HIT
2015+
SMD/DIP
19889
一级代理原装现货,特价热卖!
N/S
24+
TSSOP8
6980
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Hoffman
2022+
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全新原装 货期两周
24+
N/A
60000
一级代理-主营优势-实惠价格-不悔选择
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90+
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6790
全新原装进口自己库存优势