Compliant 2.8 W/mK Thermally Conductive Gap Filler

Tflex™ 500 is a compliant elastomer gap filler designed to provide excellent thermal

performance while remaining cost effective. This soft interface pad conforms well with

minimal pressure, resulting in little or no stress on mating parts. Tflex™ 500’s unique

silicone and filler combination has extremely low silicone extractables compared to many

other silicone interface products. Tflex™ 500 meets NASA outgassing specification.

Tflex™ 500 is naturally tacky, no adhesive coating is required. Tflex™ 500 is electrically

insulating, stable from -50ºC to 200ºC and is certified to UL 94V0 flammability rating.

FEATURES AND BENEFITS

• Thermal conductivity 2.8 W/mK

• Highly compliant and cost effective

• Low thermal resistance even at low pressure

• Available in thicknesses from 0.020-inch (0.25mm) through

0.200-inch (5.0mm) in 0.010-inch increments

• Naturally tacky for easy assembly

• Low silicone extractables

APPLICATIONS

• Cooling components to chassis

• Telecommunication hardware

• Thermal module for notebook computer

• LED solid state lighting

• Power electronics

• Computer servers

• Graphics cards

• Gaming systems

• LCD and PDP flat panel displays

• Industrial automation equipment

• Wireless infrastructure

• Fragile ASIC components

• Automotive engine control

• IT devices

• Military electronics