位置:LM832-0477 > LM832-0477详情

LM832-0477中文资料

厂家型号

LM832-0477

文件大小

14196.98Kbytes

页面数量

15

功能描述

LM832 WiFi and Bluetooth® Dual Mode Combi Module Standalone with SDIO and UART Interfaces

数据手册

下载地址一下载地址二到原厂下载

生产厂商

LMTECHNOLOGIES

LM832-0477数据手册规格书PDF详情

Features

WiFi 802.11 b/g/n

Bluetooth® v4.1 specification (Dual Mode)

SDIO for WiFi and UART (High Speed) for Bluetooth

IPEX Connector or PCB Antenna options

Full speed Bluetooth® Piconet and Scatternet supported

Enterprise level security - WPA/WPA2 certification for WiFi

1T 1R, Supporting 150Mbps Bandwidth

Support sophisticated WiFi/BT coexistence mechanism to enhance collection performance

Support Bluetooth adaptive power management mechanism

19mm x 12mm x 2mm

SMT Side and Bottom Pads for easy production

See our website for this products certifications.

RoHS, REACH and WEEE

Overview

The LM832 module incorporates an intelligent coexistances mechanism for WiFi 802.11 b/g/n via SDIO and Dual Mode Bluetooth® v4.1 via UART. This is ideal for significantly minimising the BoM cost and PCB space.

This versatile module combines WiFi and Bluetooth® radios, plus an ARM Cortex M3 microcontroller with an 8 MB flash memory for running the application. It also incorporates 4 GPIO pins for interfacing with peripheral devices.

The LM832 utilises a powerful Cypress chipset, which enables the LM832 HCI Module to be compatible with the latest Android platform, Linux Kernel v4.3.6 and Android4.4_V2.19.

It’s SMT side and bottom pads allow for easy manufacture and placement within your product.

更新时间:2025-10-5 16:11:00
供应商 型号 品牌 批号 封装 库存 备注 价格
NS/国半
2407+
BGA
7750
原装现货!实单直说!特价!
24+
N/A
74000
一级代理-主营优势-实惠价格-不悔选择
TI
23+
BGA36
5000
原装正品,假一罚十
NSC
25+
SSOP
18000
原厂直接发货进口原装
NS
11+
BGA-36
6000
绝对原装自己现货
NS/国半
23+
BGA-36
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
NSC
23+
36-MicroArr
65600
Texas Instruments
24+
36-CSBGA(3.5x3.5)
35200
一级代理/放心采购
TI
25+
36-BGA
1001
就找我吧!--邀您体验愉快问购元件!
TI
22+
36CSBGA (3.5x3.5)
9000
原厂渠道,现货配单

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