Description

The SMF series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.

SMF package is 50 smaller in footprint when compare to SMA package and deliverying one of the low height profiles (1.1mm) in the industry.

Features

• 200W peak pulsepower capability at 10/1000µs waveform, repetition rate (duty cycle): 0.01

• Compatible with industrial standard package SOD-123FL

• Low profile: maximum height of 1.1mm.

• Low inductance, excellent clamping capability

• For surface mounted applications to optimize board space

• High temperature to reflow soldering guaranteed: 260°C/40sec

• Typical failure mode is short from over-specified voltage or current

• Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c

• IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)

• ESD protection of data lines in accordance with IEC 61000-4-2

• EFT protection of data lines in accordance with IEC 61000-4-4

• Fast response time: typically less than 1.0ns from 0 Volts to VBR min

• Glass passivated junction

• Built-in strain relief

• Plastic package is flammability rated V-0 per Underwriters Laboratories

• Meet MSL level1, per J-STD-020, LF maximun peak of 260°C

• Matte tin lead–free plated

• Halogen-free and RoHS compliant

• Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/ JEDEC J-STD- 609A.01)

Applications

SMF devices are ideal for the protection of I/O interfaces, VCC bus and other vulnerable circuit used in cellular phones, portable devices, business machines, power supplies and other consumer applications.