Features

• 1500W peak pulse

capability at 10/1000μs

waveform, repetition rate

(duty cycles):0.01%

• Glass passivated chip

junction in DO-201

Package

• Fast response time:

typically less than 1.0ps

from 0 Volts to BV min

• Excellent clamping

capability

• Typical failure mode is

short from over-specified

voltage or current

• Whisker test is conducted

based on JEDEC

JESD201A per its table 4a

and 4c

• IEC-61000-4-2 ESD

30kV(Air), 30kV (Contact)

• ESD protection of data

lines in accordance with

IEC 61000-4-2

• EFT protection of data

lines in accordance with

IEC 61000-4-4

• Low incremental surge

resistance

• Typical IR less than 1μA

when VBR min>12V

• High temperature

to reflow soldering

guaranteed: 260°C/40sec

/ 0.375”,(9.5mm) lead

length, 5 lbs., (2.3kg)

tension

• VBR @ TJ

= VBR@25°C

x (1+αT x (TJ

- 25))

(αT:Temperature

Coefficient, typical value

is 0.1%)

• Plastic package is

flammability rated V-0 per

Underwriters Laboratories

• Matte tin lead–free plated

• Halogen free and RoHS

compliant

• Pb-free E3 means 2nd

level interconnect is

Pb-free and the terminal

finish material is tin(Sn)

(IPC/JEDEC J-STD609A.01)