位置:LD5537H1GL > LD5537H1GL详情
LD5537H1GL中文资料
LD5537H1GL数据手册规格书PDF详情
General Description
The LD5537H1 is built-in with several functions,
protection and EMI-improved solution in a tiny package. It
takes less components counts or circuit space, especially
ideal for those total solutions of low cost.
The implemented functions include low startup current,
green-mode power-saving operation, leading-edge
blanking of the current sensing and internal slope
compensation. It also features more protections like OLP
(Over Load Protection)、OVP (Over Voltage Protection)
and AC BNI / BNO to prevent circuit damage occurred
under abnormal conditions.
Furthermore, the frequency swapping function is to
reduce the noise level and thus helps the power circuit
designers to easily deal with the EMI filter design by
spending minimum amount of component cost and
developing time.
Features
High-Voltage CMOS Process with Excellent ESD
protection
Very Low Startup Current (<3A)
Multi-Mode PWM controller
Current Mode Control
Green Mode Control
UVLO (Under Voltage Lockout)
LEB (Leading-Edge Blanking) on CS Pin
Internal Frequency Swapping, Slop Compensation
OVP (Over Voltage Protection) on VCC and CS Pin
Adjustment input AC BNI / BNO
OLP (Over Load Protection)
OSCP (Output Short Circuit Protection)
250mA/-500mA Driving Capability
Applications
Switching AC/DC Adaptor and Battery Charger
Open Frame Switching Power Supply
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
LITTELFUSE |
24+ |
con |
35960 |
查现货到京北通宇商城 |
|||
ST/意法半导体 |
25+ |
原厂封装 |
10280 |
原厂授权代理,专注军工、汽车、医疗、工业、新能源! |
|||
ST/意法半导体 |
25+ |
原厂封装 |
9999 |
||||
ST/意法半导体 |
25+ |
原厂封装 |
11000 |
||||
ST/意法半导体 |
25+ |
原厂封装 |
10280 |
||||
ST |
22+ |
4-XDFN |
9000 |
原厂渠道,现货配单 |
|||
STMicroelectronics |
25+ |
4-XDFN 裸露焊盘 |
9350 |
独立分销商 公司只做原装 诚心经营 免费试样正品保证 |
|||
ST(意法) |
23+ |
NA |
20094 |
正纳10年以上分销经验原装进口正品做服务做口碑有支持 |
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