位置:FEDL9059E-01 > FEDL9059E-01详情

FEDL9059E-01中文资料

厂家型号

FEDL9059E-01

文件大小

410.77Kbytes

页面数量

72

功能描述

132-Channel LCD Driver with Built-in RAM for LCD Dot Matrix Displays

数据手册

下载地址一下载地址二

简称

LAPIS

生产厂商

LAPIS Semiconductor Co., Ltd.

中文名称

官网

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FEDL9059E-01数据手册规格书PDF详情

GENERAL DESCRIPTION

The ML9059E is an LSI for dot matrix graphic LCD devices carrying out bit map display. This LSI can drive a dot matrix graphic LCD display panel under the control of an 8-bit microcomputer (hereinafter described MPU). Since all the functions necessary for driving a bit map type LCD device are incorporated in a single chip, using the ML9059E makes it possible to realize a bit map type dot matrix graphic LCD display system with only a few chips.

FEATURES

• Direct display of the RAM data using the bit map method

Display RAM data “1” ... Dot is displayed

Display RAM data “0” ... Dot is not displayed (during forward display)

• Display RAM capacity

65 x 132 = 8580 bits

• LCD Drive circuits

49 common outputs, 132 segment outputs

• MPU interface: Can select an 8-bit parallel or serial interface

• Built-in voltage multiplier circuit for the LCD drive power supply

• Built-in LCD drive voltage adjustment circuit

• Built-in LCD drive bias generator circuit

• Can select frame reversal drive or line reversal drive by command

• Built-in oscillator circuit (Internal RC oscillator/external clock input)

• A variety of commands

Read/write of display data, display ON/OFF, forward/reverse display, all dots ON/all dots OFF,

set page address, set display start address, etc.

• Power supply voltage

Logic power supply: VDD-VSS = 3.7 V to 5.5 V

Voltage multiplier reference voltage: VIN-VSS = 3.7 V to 5.5 V

(2- to 4-time multiplier available)

LCD Drive voltage: VBI-VSS = 6.0 to 18 V

• Package: Gold bump chip (Bump hardness: Low, DV)

: Gold bump chip (Bump hardness: High, CV)

• This device is not resistant to radiation and light.

更新时间:2025-6-5 14:01:00
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LAPIS Semiconductor Co., Ltd.

中文资料: 313条

LAPIS Semiconductor Co., Ltd.是一家半导体公司,总部位于日本。以下是关于LAPIS Semiconductor Co., Ltd.的简介: LAPIS Semiconductor Co., Ltd.致力于为客户提供可靠的产品,并秉持着质量和安全的承诺。他们通过代工业务所培养的技术,致力于满足客户的需求和要求。公司不仅遵守系统和规则,还根据客户的需求持续改进工厂的质量,以快速响应市场变化。 作为持续改进活动的一部分,LAPIS Semiconductor Co., Ltd.(宫崎分公司)着重从根本原因出发进行改进活动。他们提出了“零设备故障”和“零外部杂质”的目标,并