180MHz, 1mA Power Efficient Rail-to-Rail I/O Op Amps

FEATURES APPLICATIONS n Gain Bandwidth Product: 180MHz n –3dB Frequency (AV = 1): 120MHz n Low Quiescent Current: 1mA Max n High Slew Rate: 90V/μs n Input Common Mode Range Includes Both Rails n Output Swings Rail-to-Rail n Low Broadband Voltage Noise: 4.2nV/√Hz n Power-Down Mode: 42μA n

0.88nV/√Hz 730MHz, 500V/μs, Low Distortion Rail-to-Rail Output Op Amps with Shutdown

FEATURES APPLICATIONS n Ultra Low Voltage Noise: 0.88nV/√Hz n Low Distortion at High Speeds: HD2/HD3

215MHz、轨至轨输出、1.1nV/√Hz、3.5mA 运放系列

2.4GHz Low Noise, Low Distortion Differential ADC Driver for 300MHz IF

文件：213.49 Kbytes Page：16 Pages

2GHz, 3.5mA Gain of 7 Stable Rail-to-Rail I/O Dual Op Amp

文件：1.03324 Mbytes Page：18 Pages

1nV/?숰z 420MHz GBW, 180V/關s, Low Distortion Rail-to-Rail Output Op Amps

文件：2.2649 Mbytes Page：28 Pages

1.3GHz Low Noise, Low Distortion Differential ADC Driver for 140MHz IF

文件：223.95 Kbytes Page：16 Pages

215MHz, Rail-to-Rail Output, 1.1nV/ root Hz, 3.5mA Op Amp Family

文件：649.98 Kbytes Page：24 Pages

215MHz, Rail-to-Rail Output

文件：790.94 Kbytes Page：24 Pages

215MHz, Rail-to-Rail Output, 1.1nV/ root Hz, 3.5mA Op Amp Family

文件：649.98 Kbytes Page：24 Pages

215MHz, Rail-to-Rail Output, 1.1nV/ root Hz, 3.5mA Op Amp Family

文件：649.98 Kbytes Page：24 Pages

Channel style heat sink with folded back fins

Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.

Channel style heat sink with folded back fins

Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.

Modular Test Probe with

文件：94.59 Kbytes Page：2 Pages

How to Use This Catalog

文件：8.73467 Mbytes Page：116 Pages

How to Use This Catalog

文件：8.73467 Mbytes Page：116 Pages