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D2516ECMDXGMEI中文资料

厂家型号

D2516ECMDXGMEI

文件大小

425.79Kbytes

页面数量

2

功能描述

Kingston i-Temp DDR3/3L DRAM for embedded applications

数据手册

下载地址一下载地址二到原厂下载

生产厂商

KINGSTON

D2516ECMDXGMEI数据手册规格书PDF详情

KEY FEATURES

• Double Data Rate architecture: two data transfers per clock cycle

• High-speed data transfer is realized by 8 bits prefetch pipelined architecture

• Bi-directional differential data strobe (DOS and /DQS) is transmitted/received

with data for capturing data at the receiver

• DOS is edge-aligned with data for READS; center-aligned with data for WRITES

• Differential clock inputs (CK and /CK)

• DLL aligns DQ and DOS transitions with CK transitions

• Commands entered on each positive CK edge; data and data mask referenced

to both edges of DQS

• Data Mask (DM) for write data

• Posted /CAS by programmable additive latency for better command and data

bus efficiency

• On-Die Termination (ODD for better signal quality)

— Synchronous ODT

— Dynamic CDT

— Asynchronous ODT

• Multi-Purpose Register (MPR) for pre-defined pattern read out

• ZQ calibration for DO drive and ODT

• Programmable Partial Array Self-Refresh (PASR)

• RESET pin for power-up sequence and reset function

• SRT range: normal/extended

• Programmable output driver impedance control

更新时间:2025-10-18 15:54:00
供应商 型号 品牌 批号 封装 库存 备注 价格
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NA/
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FBGA
880000
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BGA96
19000
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