Kingston’s ePoP provides a highly integrated JEDEC standard component that combines

Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR)

DRAM into a Package-on-Package (PoP) solution. ePoP is mounted directly on top of

a compatible host System-on-a-Chip (SoC), which reduces Printed Circuit Board (PCB)

space, and ensures optimum performance. ePoP is an ideal solution for space constrained

applications such as wearables.