DESCRIPTION

 Made with NPN silicon phototansistor chips

FEATURES

 3.0 mm x 2.0 mm SMD LED, 2.8 mm thickness

 Mechanically and spectrally matched to the infrared emitting LED lamp

 Package: 2000 pcs / reel

 Moisture sensitivity level: 3

 Tinned pads for improved solderability

 Water clear lens

 Halogen-free

 RoHS compliant

APPLICATIONS

 Infrared applied systems

 Optoelectronic switches

 Photodetector control circuits

Sensor technology