ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

ENHANCED PERFORMANCE SURFACE MOUNT EPSM?줙yperabrupt Varactor Diodes TM

文件：158.2 Kbytes Page：3 Pages

Varactors (Surface Mount)

封装/外壳：模具 包装：托盘 描述：SI TVAR NON HERMETIC EPSM SMT 分立半导体产品 二极管 - 可变电容（变容器，可变电抗器）

封装/外壳：模具 包装：托盘 描述：SI TVAR NON HERMETIC EPSM SMT 分立半导体产品 二极管 - 可变电容（变容器，可变电抗器）

Snap Bushings

文件：133.28 Kbytes Page：1 Pages

Fieldbus, 12 Pr #16 Str TC, XLPO Ins, IS/OS, TPE Jkt, CMG

文件：257.079 Kbytes Page：3 Pages

High Current Toroid Inductors

文件：117.11 Kbytes Page：1 Pages

High Current Toroid Inductors

文件：111.85 Kbytes Page：1 Pages

High Current Toroid Inductors

文件：111.85 Kbytes Page：1 Pages