型号 功能描述 生产厂家&企业 LOGO 操作
K4B4G1646B-HCNB

4GbB-dieDDR3SDRAMOlnyx16

The4GbDDR3SDRAMB-dieisorganizedasa32Mbitx16I/Osx8banks,device.Thissynchronousdeviceachieveshighspeeddouble-data-ratetransferratesofupto2133Mb/sec/pin(DDR3-2133)forgeneralapplications. KeyFeatures •JEDECstandard1.5V(1.425V~1.575V) •VDDQ=1.5V(1.425V~1.575V)

SamsungSamsung Group

三星三星半导体

Samsung

4GbB-dieDDR3SDRAMOlnyx16

The4GbDDR3SDRAMB-dieisorganizedasa32Mbitx16I/Osx8banks,device.Thissynchronousdeviceachieveshighspeeddouble-data-ratetransferratesofupto2133Mb/sec/pin(DDR3-2133)forgeneralapplications. KeyFeatures •JEDECstandard1.5V(1.425V~1.575V) •VDDQ=1.5V(1.425V~1.575V)

SamsungSamsung Group

三星三星半导体

Samsung

4GbB-dieDDR3SDRAMOlnyx16

The4GbDDR3SDRAMB-dieisorganizedasa32Mbitx16I/Osx8banks,device.Thissynchronousdeviceachieveshighspeeddouble-data-ratetransferratesofupto2133Mb/sec/pin(DDR3-2133)forgeneralapplications. KeyFeatures •JEDECstandard1.5V(1.425V~1.575V) •VDDQ=1.5V(1.425V~1.575V)

SamsungSamsung Group

三星三星半导体

Samsung

PRODUCTSELECTIONGUIDEDisplays,MemoryandStorage

Samsungcontinuestoleadtheindustrywiththebroadestportfolioofmemoryproductsand displaytechnology.Itsdisplaypanels,DRAM,flash,mobileandgraphicsmemoryarefoundinmany computers–fromultrabookstopowerfulservers–andinawiderangeofhandhelddevicessuch assmartphon

SamsungSamsung Group

三星三星半导体

Samsung

4GbE-dieDDR3LSDRAM

文件:1.98169 Mbytes Page:71 Pages

SamsungSamsung Group

三星三星半导体

Samsung
更新时间:2024-4-20 10:37:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
原装正品
BGA96
5660
国内领先的集成电路专业配单!量大可发货!可开17%增值
23+
N/A
90350
正品授权货源可靠
SAMSUNG
1234+
BGA
1532
原包原盒现货可订货价格优势
SAMSUNG/三星
2102+
BGA
6854
只做原厂原装正品假一赔十!
SAMSUNG/三星
19+
BGA
30000
进口原装现货
SAMSUNG
2023+
FBGA
700000
柒号芯城跟原厂的距离只有0.07公分
SAMSUNG/三星
FBGA
28942
原盒原标,正品现货 诚信经营 价格美丽 假一罚十
SAMSUNG
589220
16余年资质 绝对原盒原盘 更多数量
SAMSUNG
13+
BGA
320
优势
SAMSUNG/三星
21+
BGA
10000
原装现货假一罚十

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