FEATURES

• 1500W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%

• Excellent clamping capability

• Low incremental surge resistance

• Typical IR less than 1μA when VBR min>12V

• For surface mounted applications to optimize board space

• Low profle package

• Built-in strain relief

• Typical failure mode is short from over-specifed voltage or current

• Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c

• IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)

• ESD protection of data lines in accordance with IEC 61000-4-2

• EFT protection of data lines in accordance with IEC 61000-4-4

• Fast response time: typically less than 1.0ps from 0V to BV min

• Glass passivated chip junction

• High temperature to reflow soldering guaranteed: 260°C/40sec

• VBR @ TJ= VBR@25°C x (1+αT x (TJ - 25))(αT:Temperature Coeffcient, typical value is 0.1%)

• Plastic package is flammability rated V-0 per Underwriters Laboratories

• Meet MSL level1, per J-STD-020, LF maximun peak of 260°C

• Matte tin lead–free plated

• RoHS compliant

• Pb-free E3 means 2nd level interconnect is Pb-free and the terminal fnish material is tin(Sn) (IPC/JEDEC J-STD-609A.01)