Dual Power HiPerFET™ Module

Phaseleg Configuration

Features

• HiPerFET TM technology

– low RDSon

– unclamped inductive switching (UIS) capability

– dv/dt ruggedness

– fast intrinsic reverse diode

– low gate charge

• thermistor for internal temperature measurement

• package

– low inductive current path

– screw connection to high current main terminals

– use of non interchangeable connectors for auxiliary terminals possible

– Kelvin source terminals for easy drive

– isolated DCB ceramic base plate

Applications

• converters with high power density and high switching speed for

– power supplies

– induction heating