Features

• Silicon chip on Direct-Copper-Bond substrate

- High power dissipation

- Isolated mounting surface

- 2500V electrical isolation

• Low cathode to tab capacitance (<25pF)

• International standard package

• Planar passivated chips

• Very short recovery time

• Extremely low switching losses

• Low IRM-values

• Soft recovery behaviour

• Epoxy meets UL 94V-0

• Isolated and UL registered E153432

Applications

• Antiparallel diode for high frequency switching devices

• Antisaturation diode

• Snubber diode

• Free wheeling diode in converters and motor control circuits

• Rectifiers in switch mode power supplies (SMPS)

• Inductive heating

• Uninterruptible power supplies (UPS)

• Ultrasonic cleaners and welders