Features

• HiPerFET™ technology

- low RDSon

- low gate charge for high frequency operation

- unclamped inductive switching (UIS) capability

- dv/dt ruggedness

- fast intrinsic reverse diode

• ISOPLUS i4-PACTM package

- isolated back surface

- low coupling capacity between pins and heatsink

- enlarged creepage towards heatsink

- application friendly pinout

- low inductive current path

- high reliability

- industry standard outline

- UL registered E 72873

Applications

• drives and power supplies

• battery or fuel cell powered

• automotive, industrial vehicle etc.

• secondary side of mains power supplies