Features

● Silicon chip on Direct-Copper-Bond substrate

- High power dissipation

- Isolated mounting surface

- 2500V electrical isolation

● Low cathode to tab capacitance (<25pF)

● International standard package

● Planar passivated chips

● Very short recovery time

● Extremely low switching losses

● Low IRM-values

● Soft recovery behaviour

● Epoxy meets UL 94V-0

● Isolated and UL registered E153432

Applications

● Antiparallel diode for high frequency switching devices

● Antisaturation diode

● Snubber diode

● Free wheeling diode in converters and motor control circuits

● Rectifiers in switch mode power supplies (SMPS)

● Inductive heating

● Uninterruptible power supplies (UPS)

● Ultrasonic cleaners and welders