FEATURES

• Low-voltage Core and I/O Power Supplies

VDD2 = 1.14-1.30V, VDDCA/VDDQ = 1.14-1.30V,

VDD1 = 1.70-1.95V

• High Speed Un-terminated Logic(HSUL_12) I/O

Interface

• Clock Frequency Range : 10MHz to 533MHz

(data rate range : 20Mbps to 1066Mbps per I/O)

• Four-bit Pre-fetch DDR Architecture

• Multiplexed, double data rate, command/address

inputs

• Eight internal banks for concurrent operation

• Bidirectional/differential data strobe per byte of

data (DQS/DQS#)

• Programmable Read/Write latencies(RL/WL)

and burst lengths(4,8 or 16)

• ZQ Calibration

• On-chip temperature sensor to control self refresh

rate

• Partial –array self refresh(PASR)

• Deep power-down mode(DPD)

• Operation Temperature

Commercial (TC = 0°C to 85°C)

Industrial (TC = -40°C to 85°C)

Automotive, A1 (TC = -40°C to 85°C)

Automotive, A2 (TC = -40°C to 105°C)

Automotive, A25 (TC = -40°C to 115°C)(3)