FEATURES

• Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V

• Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V

- Backward compatible to 1.5V

• High speed data transfer rates with system

frequency up to 1066 MHz

• 8 internal banks for concurrent operation

• 8n-Bit pre-fetch architecture

• Programmable CAS Latency

• Programmable Additive Latency: 0, CL-1,CL-2

• Programmable CAS WRITE latency (CWL) based

on tCK

• Programmable Burst Length: 4 and 8

• Programmable Burst Sequence: Sequential or

Interleave

• BL switch on the fly

• Auto Self Refresh(ASR)

• Self Refresh Temperature (SRT)

• Refresh Interval:

7.8 μs (8192 cycles/64 ms) Tc= -40°C to 85°C

3.9 μs (8192 cycles/32 ms) Tc= 85°C to 105°C

1.95 μs (8192 cycles/16 ms) Tc= 105°C to 115°C

0.97 μs (8192 cycles/8 ms) Tc= 115°C to 125°C

• Partial Array Self Refresh

• Asynchronous RESET pin

• TDQS (Termination Data Strobe) supported (x8 only)

• OCD (Off-Chip Driver Impedance Adjustment)

• Dynamic ODT (On-Die Termination)

• Driver strength : RZQ/7, RZQ/6 (RZQ = 240 Ω)

• Write Leveling

• Up to 200 MHz in DLL off mode

• Operating temperature:

Commercial (TC = 0°C to +95°C)

Industrial (TC = -40°C to +95°C)

Automotive, A1 (TC = -40°C to +95°C)

Automotive, A2 (TC = -40°C to +105°C)

Automotive, A25 (TC = -40°C to +115°C)

Automotive, A3 (TC = -40°C to +125°C)