位置:IS25WE256E > IS25WE256E详情

IS25WE256E中文资料

厂家型号

IS25WE256E

文件大小

2570.26Kbytes

页面数量

197

功能描述

SERIAL FLASH MEMORY 133/166MHZ MULTI I/O SPI & QUAD I/O QPI DTR INTERFACE WITH ON-CHIP ECC

数据手册

下载地址一下载地址二

生产厂商

ISSI

IS25WE256E数据手册规格书PDF详情

FEATURES

• Industry Standard Serial Interface

- IS25LE256E: 256Mbit/32Mbyte

- IS25LE128E: 128Mbit/16Mbyte

- IS25WE256E: 256Mbit/32Mbyte

- IS25WE128E: 128Mbit/16Mbyte

- 3 or 4 Byte Addressing Mode

- Supports Standard SPI, Fast, Dual, Dual

I/O, Quad, Quad I/O, SPI DTR, Dual I/O

DTR, Quad I/O DTR, and QPI

- Software & Hardware Reset

- Supports Serial Flash Discoverable

Parameters (SFDP)

• High Performance Serial Flash (SPI)

- 50MHz Normal Read

- Up to166Mhz Fast Read (3)

- Up to 80MHz DTR (Dual Transfer Rate)

- Equivalent Throughput of 664 Mb/s

- Selectable Dummy Cycles

- Configurable Drive Strength

- Supports SPI Modes 0 and 3

- More than 100,000 Erase/Program Cycles

- More than 20-year Data Retention

- 1-bit ERROR Detection and Correction

per 64-bit boundary (with ECC)

• Flexible & Efficient Memory Architecture

- Chip Erase with Uniform Sector/Block

Erase (4/32/64KB or 4/32/256 KB)(2)

- Program 1 to 256 or 512 Byte per Page(2)

- Program/Erase Suspend & Resume

• Efficient Read and Program modes

- Low Instruction Overhead Operations

- Continuous Read 8/16/32/64 Byte

Burst Wrap

- Selectable Burst Length

- AutoBoot Operation

- Data Learning Pattern for training in DTR

operation

• Low Power with Wide Temp. Ranges

- Single Voltage Supply

IS25LE: 2.30V to 3.60V

IS25WE: 1.70V to 1.95V

- 8 mA Active Read Current

- 10 μA Standby Current

- 1 μA Deep Power Down

- Temp Grades:

Extended: -40°C to +105°C

Auto Grade (A3): -40°C to +125°C

• Advanced Security Protection

- Software and Hardware Write Protection

- Advanced Sector/Block Protection

- Top/Bottom Block Protection

- Power Supply Lock Protection

- 4x256 Byte Dedicated Security Area

with OTP User-lockable Bits

- 128 bit Unique ID for Each Device

(Call Factory)

• Industry Standard Pin-out & Packages(1)

- M =16-pin SOIC 300mil

- L = 8-contact WSON 8x6mm

- G = 24-ball TFBGA 6x8mm (4x6 ball array)

- H = 24-ball TFBGA 6x8mm (5x5 ball array)

- W = KGD (Call Factory)

- Green Package (RoHS Compliant,

Halogen-Free) and TSCA Compliant

更新时间:2025-12-24 10:29:00
供应商 型号 品牌 批号 封装 库存 备注 价格
ISSI, Integrated Silicon Solut
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就找我吧!--邀您体验愉快问购元件!
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