FEATURES

• Industry Standard Serial Interface

- IS25LP512M: 512Mbit/64Mbyte

- IS25WP512M: 512Mbit/64Mbyte

- 3 or 4 Byte Addressing Mode

- Supports Standard SPI, Fast, Dual, Dual

I/O, Quad, Quad I/O, SPI DTR, Dual I/O

DTR, Quad I/O DTR, and QPI

- Software & Hardware Reset

- Supports Serial Flash Discoverable

Parameters (SFDP)

• High Performance Serial Flash (SPI)

- 50MHz Normal Read

- Up to133Mhz Fast Read:

133MHz (max) for 3.0V

112MHz (max) for 1.8V

- Up to 66MHz DTR (Dual Transfer Rate)

- Equivalent Throughput of 532 Mb/s

- Selectable Dummy Cycles

- Configurable Drive Strength

- Supports SPI Modes 0 and 3

- More than 100,000 Erase/Program Cycles

- More than 20-year Data Retention

• Flexible & Efficient Memory Architecture

- Chip Erase with Uniform Sector/Block

Erase (4/32/64KB or 4/32/256 KB)

(2)

- Program 1 to 256 or 512 Byte per Page(2)

- Program/Erase Suspend & Resume

• Efficient Read and Program modes

- Low Instruction Overhead Operations

- Continuous Read 8/16/32/64 Byte

Burst Wrap

- Selectable Burst Length

- QPI for Reduced Instruction Overhead

- Data Learning Pattern for training in DTR

operation

• Low Power with Wide Temp. Ranges

- Single Voltage Supply

IS25LP: 2.30V to 3.60V

IS25WP: 1.70V to 1.95V

- 13 mA Active Read Current

- 21 µA Standby Current

- 1 µA Deep Power Down

- Temp Grades:

Extended: -40°C to +105°C

Auto Grade (A3): -40°C to +125°C

• Advanced Security Protection

- Software and Hardware Write Protection

- Advanced Sector/Block Protection

- Top/Bottom Block Protection

- Power Supply Lock Protection

- 4x256 Byte Dedicated Security Area

with OTP User-lockable Bits

- 128 bit Unique ID for Each Device

(Call Factory)

• Industry Standard Pin-out & Packages(1)

- M =16-pin SOIC 300mil(2)

- L = 8-contact WSON 8x6mm(2)

- G = 24-ball TFBGA 6x8mm (4x6 ball array)(2)

- H = 24-ball TFBGA 6x8mm (5x5 ball array)(2)