FEATURES

• Industry Standard Serial Interface

- IS25LP016D: 16Mbit/2Mbyte

- IS25WP016D: 16Mbit/2Mbyte

- 256 bytes per Programmable Page

- Supports standard SPI, Fast, Dual, Dual

I/O, Quad, Quad I/O, SPI DTR, Dual I/O

DTR, Quad I/O DTR, and QPI

- Supports Serial Flash Discoverable

Parameters (SFDP)

• High Performance Serial Flash (SPI)

- 50MHz Normal and 133Mhz Fast Read

- 532 MHz equivalent QPI

- DTR (Dual Transfer Rate) up to 66MHz

- Selectable Dummy Cycles

- Configurable Drive Strength

- Supports SPI Modes 0 and 3

- More than 100,000 Erase/Program Cycles

- More than 20-year Data Retention

• Flexible & Efficient Memory Architecture

- Chip Erase with Uniform: Sector/Block

Erase (4/32/64 Kbyte)

- Program 1 to 256 Bytes per Page

- Program/Erase Suspend & Resume

• Efficient Read and Program modes

- Low Instruction Overhead Operations

- Continuous Read 8/16/32/64-Byte

Burst Wrap

- Selectable Burst Length

- AutoBoot Operation

• Low Power with Wide Temp. Ranges

- Single Voltage Supply

IS25LP: 2.30V to 3.75V(1)

IS25WP: 1.65V to 1.95V

- 4 mA Active Read Current (typ.)

- 5 μA Standby Current (typ.)

- 1 μA Deep Power Down (typ.)

- Temp Grades:

Extended: -40°C to +105°C

Auto Grade (A3): -40°C to +125°C

Note:

1. 3.6V for Automotive Grade (A3)

• Advanced Security Protection

- Software and Hardware Write Protection

- Power Supply Lock Protect

- 4x256-Byte Dedicated Security Area

with OTP User-lockable Bits

- 128 bit Unique ID for Each Device

(Call Factory)

• Industry Standard Pin-out & Packages(1,2)

- B = 8-pin SOIC 208mil

- N = 8-pin SOIC 150mil

- V = 8-pin VVSOP 150mil

- K = 8-contact WSON 6x5mm

- U = 8-contact USON 2x3mm

- T = 8-contact USON 4x3mm

- M = 16-pin SOIC 300mil (Call Factory)

- L = 8-contact WSON 8x6mm

- G= 24-ball TFBGA 6x8mm 4x6(Call Factory)

- H = 24-ball TFBGA 6x8mm 5x5 (Call Factory)

- W = KGD (Call Factory)

- Green Package (RoHS Compliant,

Halogen-Free) and TSCA Compliant