FEATURES

 Industry Standard Serial Interface

- IS25DLP/DWP512M: 512Mbit/64Mbyte

- Dual Die Stack of two IS25LP/WP256D

- Supports standard SPI and QPI protocols

- Double Transfer Rate (DTR) : SPI DTR,

Dual I/O SPI DTR , and Quad I/O SPI

DTR

- Supports Serial Flash Discoverable

Parameters (SFDP)

- Support Hardware RESET# Feature

 High Performance Serial Flash (SPI)

- 80MHz Normal Read

- Up to166Mhz Fast Read:

-166MHz at Vcc=2.7V to 3.6V (1)

-133MHz at Vcc=2.3V to 3.6V

-133MHz at Vcc=1.65V to 1.95V (2)

- Up to 80MHz DTR (Dual Transfer Rate)

- Equivalent Throughput of 664 Mb/s

- Selectable Dummy Cycles

- Configurable Drive Strength

- Supports SPI Modes 0 and 3

- More than 100,000 Erase/Program Cycles

- More than 20-year Data Retention

 Flexible & Efficient Memory Architecture

- Chip Erase with Uniform: Sector/Block

Erase (4/32/64 Kbyte)

- Program 1 to 256 bytes per page per die

- Program/Erase Suspend & Resume

 Efficient Read and Program modes

- Low Instruction Overhead Operations

- QPI for reduced instruction overhead

- Continuous Read 8/16/32/64-Byte Burst

Wrap

- Selectable burst length

 Low Power with Wide Temp.

Ranges

- Single Voltage Supply

IS25DLP: 2.30V to 3.60V

IS25DWP: 1.65V to 1.95V

- 10 mA Active Read Current per die

- 8 μA Standby Current per die

- 1 μA Deep Power Down per die

- Temp Grades:

Extended: -40°C to +105°C

Auto Grade (A2): -40°C to +105°C

Auto Grade (A3): -40°C to +125°C

 Advanced Security Protection

- Software and Hardware Write Protection

- Power Supply lock protect

- 4x256-Byte dedicated security area per

die with user-lockable bits, (OTP) One

Time Programmable Memory

- 128 bit Unique ID for each device

(Call Factory)

 Industry Standard Pin-out & Packages

- M = 16-pin SOIC 300mil

- H = 24-ball TFBGA 6x8mm 5x5 (Call

Factory)