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IS22TF16G-BCLI中文资料
IS22TF16G-BCLI数据手册规格书PDF详情
GENERAL DESCRIPTION
ISSI eMMC products follow the JEDEC eMMC 5.1 standard. It is ideal for embedded storage solutions for Industrial application and automotive application, which require high performance across a wide range of operating temperatures. eMMC encloses the TLC Mode NAND and eMMC controller inside as one JEDEC standard package, providing a standard interface to the host. The eMMC controller directly manages NAND flash, including ECC, wear-leveling, IOPS optimization and read sensing.
FEATURES
• Packaged NAND flash memory with eMMC 5.1 interface
- IS21/22TF16G: 16Gigabyte
- IS21/22TF32G: 32Gigabyte
- IS21/22TF64G: 64Gigabyte
- IS21/22TF128G: 128Gigabyte
• Compliant with eMMC Specification Ver.4.3, 4.4, 4.41,4.5, 4.51, 5.0, 5.1
• Device can be converted to eMMC 4.3, 4.41, 4.51, 5.0 via initializing
• Bus mode
- High-speed eMMC protocol
- Clock frequency: 0-200MHz.
- Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset.
• Supports three different data bus widths : 1 bit(default), 4 bits, 8 bits
- Data transfer rate: up to 52Mbyte/s (using 8 parallel data lines at 52 MHz)
- Single data rate : up to 200Mbyte/s @ 200MHz (HS200)
- Dual data rate : up to 400Mbyte/s @ 200MHz (HS400)
• Operating voltage range :
- VCCQ = 1.8 V/3.3 V (Automotive A2 Grade only supports 1.8V VCCQ)
- VCC = 2.7 – 3.6V
• Error free memory access
- Internal error correction code (ECC) to protect data communication
- Internal enhanced data management algorithm
- Solid protection from sudden power failure, safe-update operations for data content
• Security
- Support secure erase and trim commands
- Enhanced write protection with permanent and partial protection options
• Key Features :
- HS400, Field Firmware Update (FFU), Power Off Notification, Pre EOL information, Enhanced Device Life
time, Optimal Size
• eMMC 5.1 Features:
- Command Queuing, Enhanced Strobe, Cache Flushing Report, BKOPS Control, Cache Barrier, RPMB
Throughput Improve, Secure Write Protection.
• Temperature range
- Industrial Grade (I): -40 ℃ ~ 85 ℃
- Automotive Grade (A1): -40 ℃ ~ 85 ℃
- Automotive Grade (A2): -40 ℃ ~ 105 ℃ (The Surface Temperature of Tc cannot be over 115 ℃)
• Package
- 153 FBGA (11.5mm x 13mm x 1.0mm)
- 100 FBGA (14.0mm x 18.0mm x 1.4mm)
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
ISSI |
23+ |
BGA |
4500 |
ISSI存储芯片在售 |
|||
ISSI |
24+ |
DIP |
4500 |
原装正品!公司现货!欢迎来电! |
|||
ISSI |
24+ |
DIP-8 |
1366 |
||||
ISSI |
14+ |
COB |
40000 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
ISSI Integrated Silicon Soluti |
23+/24+ |
153-VFBGA |
8600 |
只供原装进口公司现货+可订货 |
|||
新 |
79 |
全新原装 货期两周 |
|||||
XP |
2021+ |
SIP |
11000 |
十年专营原装现货,假一赔十 |
|||
XP Power |
24+ |
N/A |
12000 |
一级代理保证进口原装正品假一罚十价格合理 |
|||
N/A |
2023+ |
N/A |
8800 |
正品渠道现货 终端可提供BOM表配单。 |
|||
N/A |
23+ |
NA |
8000 |
只做原装现货 |
IS22TF16G-BCLI 资料下载更多...
IS22TF16G-BCLI 芯片相关型号
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Integrated Silicon Solution Inc 北京矽成半导体有限公司
北京矽成半导体有限公司(简称ISSI)成立于1988年,是全球技术领先的集成电路设计企业,2020年被北京君正并购,目前为北京君正集成电路股份有限公司全资子公司。 北京矽成(ISSI)专注于高性能、高品质、高可靠性的各类存储芯片(DRAM, SRAM, Flash等)的研发、设计和销售,另有子品牌LUMISSIL专注于模拟混合信号芯片的研发和销售。产品主要面向全球汽车电子、工业、医疗、网络通信及特定消费类市场。 北京矽成(ISSI)致力于为客户提供更长生命周期的高品质产品。公司通过了ISO 9001、ISO 14001认证,同时合作伙伴全部通过IATF 16949认证。所有车规级产品全部通过A