FEATURES

·Guard -Ring for Stress Protection

·Low Forward Voltage

·High Operating Junction Temperature

·Guaranteed Reverse Avalanche

·Low Power Loss/High Efficiency

·High surge capability

·Low Stored Charge Majority Carrier Conduction

·Minimum Lot-to-Lot variations for robust device

performance and reliable operation

MECHANICAL CHARACTERISTICS

·Case: Epoxy, Molded

·Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable

·Lead Temperature for Soldering Purposes: 260℃ Max, for 10 Seconds.