DESCRIPTION

Third Generation HEXFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

The TO-220 Fullpak eliminates the need for additional insulating hardware in commercial-industrial applications. The molding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The Fullpak is mounted to a heatsink using a single clip or by a single screw fixing.

• Isolated Package

• High Voltage Isolation = 2.5 kVRMS

• Sink to Lead Creepage Dist. = 4.8 mm

• Logic-Level Gate Drive

• RDS (on) Specified at VGS = 4 V & 5 V

• Fast Switching

• Ease of Paralleling