Description

Third Generation HEXFETs from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

The 4-pin DIP package is a low cost machine-insertiable case style which can be stacked in multiple combinations on standard 0.1 inch pin centers. The dual drain servers as a thermal link to the mounting surface for power dissipation levels up to 1 watt.

• Dynamic dV/dt Rating

• For Automatic Insertion

• End Stackable

• Logic-Level Gate Drive

• RDS(on) Specified at VGS = 4 V & 5 V

• 175 °C Operating Temperature

• Fast Switching