Description

Third generation HEXFETs from international Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

The D2Pak is a surface mount power package capable ofthe accommodatingdie sizes up to HEX-4. It provides the highest power capability and the lowest possible on resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRFBC30L) is available for low-profile applications.

● Surface Mount (IRFBC30S)

● Low-profile through-hole (IRFBC30L)

● Available in Tape & Reel (IRFBC30S)

● Dynamic dv/dt Rating

● 150°C Operating Temperature

● Fast Switching

● Fully Avalanche Rated