Description

The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and dual-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.

● Adavanced Process Technology

● Ultra Low On-Resistance

● Dual N-Channel MOSFET

● Surface Mount

● Available in Tape & Reel

● Dynamic dv/dt Rating

● Fast Switching

● Lead-Free