Features

• Low VCE (on) Non Punch Through IGBT Technology

• Low Diode VF

• 10µs Short Circuit Capability

• Square RBSOA

• HEXFRED Antiparallel Diode with Ultrasoft Diode Reverse Recovery Characteristics

• Positive VCE (on) Temperature Coefficient

• Ceramic DBC Substrate

• Low Stray Inductance Design

Benefits

• Benchmark Efficiency for Motor Control

• Rugged Transient Performance

• Low EMI, Requires Less Snubbing

• Direct Mounting to Heatsink

• PCB Solderable Terminals

• Low Junction to Case Thermal Resistance

• UL Listed