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S10-TXOVERVIEW中文资料

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S10-TXOVERVIEW

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Intel® Stratix® 10 TX Device Overview

数据手册

下载地址一下载地址二到原厂下载

简称

INTEL英特尔

生产厂商

Intel Corporation

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S10-TXOVERVIEW数据手册规格书PDF详情

Intel® Stratix® 10 TX FPGAs feature power-efficient, dual-mode transceivers, capable

of both 57.8 Gbps PAM4 (Pulse Amplitude Modulation) and 28.9 Gbps NRZ (Non

Return to Zero) operation. Supported by hardened PCI Express Gen 3 and 10/25/100

Gbps Ethernet MAC IP blocks, these devices can deliver over 8 Tbps of aggregate

bandwidth, meeting the demanding transceiver bandwidth and power budget

specifications of next generation designs.

In addition to the 57.8 Gbps PAM4 / 28.9 Gbps NRZ dual-mode transceivers, Intel

Stratix 10 TX devices feature several other breakthrough innovations. These include

all new HyperFlex® core architecture, hardened floating point DSP blocks, hardened

external memory controllers and advanced packaging technology based on Intel's

Embedded Multi-die Interconnect Bridge (EMIB).

With an embedded quad-core 64-bit Arm* Cortex*-A53 hard processor system (HPS)

available in select devices, Intel Stratix 10 TX FPGAs deliver power efficient,

application-class processing, and allow designers to extend hardware virtualization

into the FPGA fabric.

Intel Stratix 10 TX FPGAs integrate a monolithic 14 nm FPGA fabric die with multiple

high-speed transceiver tiles, all inside a single flip-chip BGA package. This

implementation, combined with the unmatched transceiver bandwidth and core fabric

performance, demonstrates Intel's commitment to deliver high-performance

programmable solutions to your most challenging system design problems.

Important innovations in Intel Stratix 10 TX devices include:

• All new Intel Hyperflex™ core architecture delivering 2X the core performance

compared to previous generation high-performance FPGAs

• Intel 14 nm tri-gate (FinFET) technology

• Heterogeneous 3D System-in-Package (SiP) technology

• Monolithic core fabric with up to 2.8 million logic elements (LEs)

• Up to 144 full duplex transceiver channels on heterogeneous 3D SiP transceiver tiles

• Transceiver data rates up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ for chip-to-chip,

chip-to-module, and backplane applications

• Embedded eSRAM (47.25 Mbit) in select devices, and M20K (20 Kb) internal SRAM

memory blocks

• Fractional synthesis and ultra-low jitter LC tank based transmit phase locked loops

(PLLs)

• Hard PCI Express® Gen3 x16 intellectual property (IP) blocks

• Hard 10/25/100 Gbps Ethernet MAC with dedicated Reed-Solomon FEC for NRZ

signals (528, 514) and PAM4 signals (544, 514)

更新时间:2025-6-6 14:50:00
供应商 型号 品牌 批号 封装 库存 备注 价格
DIODES/美台
22+
PowerDI5
20000
保证原装正品,假一陪十
DIODES/美台
22+
PowerDI5
100000
代理渠道/只做原装/可含税
TO-277
23+
NA
15659
振宏微专业只做正品,假一罚百!
AK
1936+
DO-277
6852
只做原装正品现货或订货!假一赔十!
DIODES/美台
23+
TO-277
15000
一级代理原装现货
DIODES/美台
2447
QFN
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
DIODES
23+
TO-277
50000
全新原装正品现货,支持订货
TAYCHIPST
23+
TO-277
50000
全新原装正品现货,支持订货
DIODES
13+
TO-277
85
一级代理,专注军工、汽车、医疗、工业、新能源、电力
TAYCHIPST
23+
TO-277
5551
原厂原装正品

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Intel Corporation

中文资料: 14608条

英特尔(Intel)是美国一家主要以研制CPU处理器的公司,是全球最大的个人计算机零件和CPU制造商,它成立于1968年,具有48年产品创新和市场领导的历史。 1971年,英特尔推出了全球第一个微处理器。微处理器所带来的计算机和互联网革命,改变了整个世界。在2016年世界五百强中排在第51位。2014年2月19日,英特尔推出处理器至强E7v2系列采用了多达15个处理器核心,成为英特尔核心数最多的处理器。2014年3月5日,Intel收购智能手表BasisHealthTrackerWatch的制造商BasisScience。2014年8月14日,英特尔6.5亿美元收购Avago旗下公司网络业务。