The 0.25 µm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible block locking allows any block to be independently locked or unlocked. Add to this the Intel-developed Flash Data Integrator (FDI) software and you have a cost-effective, flexible, monolithic code plus data storage solution on the market today. 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 40-lead TSOP, and 48-ball µBGA* packages.

■ Flexible SmartVoltage Technology

- 2.7 V–3.6 V Read/Program/Erase

- 2.7 V or 1.65 V I/O Option Reduces Overall System Power

- 12 V for Fast Production Programming

■ High Performance

- 2.7 V–3.6 V: 90 ns Max Access Time

- 3.0 V–3.6 V: 80 ns Max Access Time

■ Optimized Architecture for Code Plus Data Storage

- Eight 8-Kbyte Blocks, Top or Bottom Locations

- Up to Sixty-Three 64-KB Blocks

- Fast Program Suspend Capability

- Fast Erase Suspend Capability

■ Flexible Block Locking

- Lock/Unlock Any Block

- Full Protection on Power-Up

- WP# Pin for Hardware Block Protection

- VPP = GND Option

- VCC Lockout Voltage

■ Low Power Consumption

- 9 mA Typical Read Power

- 10 µA Typical Standby Power with Automatic Power Savings Feature

■ Extended Temperature Operation

- –40 °C to +85 °C

■ Easy-12 V

- Faster Production Programming

- No Additional System Logic

■ 128-bit Protection Register

- 64-bit Unique Device Identifier

- 64-bit User Programmable OTP Cells

■ Extended Cycling Capability

- Minimum 100,000 Block Erase Cycles

■ Flash Data Integrator Software

- Flash Memory Manager

- System Interrupt Manager

- Supports Parameter Storage, Streaming Data (e.g., voice)

■ Automated Word/Byte Program and Block Erase

- Command User Interface

- Status Registers

■ SRAM-Compatible Write Interface

■ Cross-Compatible Command Support

- Intel Basic Command Set

- Common Flash Interface

■ x 16 for High Performance

- 48-Ball µBGA* Package

- 48-Lead TSOP Package

■ x 8 I/O for Space Savings

- 48-Ball µBGA* Package

- 40-Lead TSOP Package

■ 0.25 µ ETOX™ VI Flash Technology